American Opto Plus LED C/A561SR-5 G/W 0.56inch (14.22 mm) height Low power consumption RoHS Compliance 0.56'' Single Digit Seven Segment Display Case mold type Package Dimensions Notes: 1. Label Notes: A: Part Number B: Date C: Bin Code 2. All dimensions are in millimeters (inches) 3. Tolerance is 0.25mm (0.01") unless otherwise specified Feb. 2005 Rev. 1.0 American Opto Plus LED C/A561SR-5 G/W 0.56inch (14.22 mm) height Low power consumption RoHS Compliance 0.56'' Single Digit Seven Segment Display Case mold type DEVICE SELECTION GUIDE Part Number Chip Material AlGaAs C/A 561SR-5 G/W Face / Segment Emitted Color Super Red Gray / White ABSOLUTE MAXIMUM RATINGS Parameter (Ta=25C) Symbol Max Rating Unit PAD 72 mW IAF 100 mA Continuous Forward Current per segment IPF 30 mA Reverse Voltage VR 5.0 V Operating Temperature Range TOPR -40~+85 C Storage Temperature Range TSTG -40~+85 C Power Dissipation per segment Peak Current per segment (1/10 Duty Cycle @1KHz ) Solder temperature 1.6 mm from body for 3 seconds at 260C OPTICAL-ELECTRICAL CHARACTERISTICS Parameter Symbol Test Condition Min Typ 5000 18000 Max Unit cd Ave. Luminous Intensity IV IF = 10mA Forward Voltage/segment VF IF = 10mA Reverse Current/segment IR VR = 5V Spectrum Line Half-Width IF = 10mA 20 nm Dominant Wavelength d IF = 10mA 645 nm Peak Wavelength p IF = 10mA 660 nm 1.75 2.4 V 10 uA American Opto Plus LED C/A561SR-5 G/W 0.56inch (14.22 mm) height Low power consumption RoHS Compliance 0.56'' Single Digit Seven Segment Display Case mold type TYPICAL ELECTRO-OPTICAL CHARACTERISTIC CURVES: SUPER RED (SR) American Opto Plus LED C/A561SR-5 G/W 0.56inch (14.22 mm) height Low power consumption RoHS Compliance 0.56'' Single Digit Seven Segment Display Case mold type WAVE SOLDERING American Opto Plus LED C/A561SR-5 G/W 0.56inch (14.22 mm) height Low power consumption RoHS Compliance 0.56'' Single Digit Seven Segment Display Case mold type LAMP HANDLING AND APPLICATION PRECAUTIONS STORAGE 1. It is recommended to store the products in the following conditions: a. Humidity: 60% RH Max Temperature: 5C ~ 40C (41F ~ 105F) b. Shelf life in sealed bag: 3 month < 40C and 90% RH FORMING 1. Any forming on lead pin must be done before solding, not during or after soldering 2. Avoid applying any stress to resin in order to prevent the epoxy fracture and break on bonding wire. 3. While forming, please use a tie bar cut or equivalent ot hold or bend the pin. 4. 2mm from the base of resin is the minimum distance for the place bending the lead pin 5. Avoid bending the lead pin at the same point twice or more SOLDERING 1. No stress can be applied to lead pins when they are heated, otherwise disconnection may occur. 2. When an LED is mounted into a P.C. board, pitch spacing should be aligned carefully to avoid causing any stress to the lead wires. 3. Mounting direction (electrode direction) of SMD LED and Display should be perpendicular to direction of PCB curve 4. After soldering, don't bend the PCB CLEANING 1. Avoid using any unspecified chemical solvent to clean LED. For example, Trichoroethylene, Chlorosen, Acetone, and Diflon S3MC. 2. Any cleaning method can only be taken under normal temperature in one minute or less if it is required 3. Special attention should be taken when using any chemicals for claning because some chemicals may damage the surface of epoxy.